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Electronic plating refers to the plating of a thin layer of metal, such as copper, nickel, tin, gold, silver, platinum, rhodium, palladium, or its alloy metal on the surface of electronic components. Electronic plating process can be widely used in many application fields, including circuit board plating and connector plating in batch plating process, as well as diversified continuous plating process used in the production of semiconductors, connectors and other components for electronic industry In these processes, both soluble and inert titanium anodes are used.

 

Circuit board reverse pulse copper plating

 

Due to the design requirements of circuit board tend to fine wire diameter, high density, fine hole diameter (high depth diameter ratio, even micro through hole), filling blind hole, the traditional DC plating becomes more and more unable to meet the requirements, especially in the coating of hole center of through-hole plating, usually the copper layer at both ends of the hole diameter is too thick but the central copper layer is insufficient. The unevenness of the coating will affect the effect of current transmission and directly lead to poor product quality. In order to balance the thickness of copper on the surface, especially in the pores and micropores, it is necessary to reduce the current density, but this will prolong the plating time to an unacceptable extent. With the development of reverse pulse electroplating process and chemical additives suitable for electroplating process, shortening the electroplating time has become a reality. These problems can be overcome by reverse pulse electroplating process.

 

Typical process conditions

 

Electrolyte: CuSO4 · 5H2O, 100-300 g / L H2SO4, 50-150 g / L additive temperature: 20 - 70 ° C

 

Current density: usually 500-1000a / m2 forward pulse current and three times reverse pulse current; general forward pulse 19ms, reverse 1ms;

 

Or adjust the current density and pulse time anode type according to the process: special iridium metal oxide mixture coating

Vertical continuous DC copper plating of circuit board

 

Typical process conditions

 

Electrolyte: CuSO4 · 5H2O, 200-240 g / L H2SO4, 80-100 g / L Cl -, 40-55 ppm additives temperature: 20-70 ° c current density: 100-500 A / m ² DC

 

Anode type: special iridium metal oxide mixture coated titanium anode; special requirements for additive consumption

 

Circuit board gold plating

 

Electroplating a layer of nickel, tin or gold on the end contact part of electronic components can improve its conductivity. In circuit board manufacturing, usually a layer of nickel / gold is electrodeposited, which can make the contact point have low contact resistance, good wear resistance and oxidation resistance, as well as corrosion protection.

 

Typical process conditions

 

Electrolyte acid / cyanide systems, brighteners and additives

Au : 4-10 g/l

CN -: low concentration pH: 4-5

Temperature: 50-60 ° C

Current density: 0.1 – 1.0 ASD; average 0.2 ASD

Anode type: platinum and IR MMO coating can be used;

 

The thickness of platinum on electroplated platinum anode can be selected from 1um to 10um, or even thicker

Other fields

 

Semiconductor components electroplating: roll to roll plating, contactor parts plating, lead frame plating, electropolishing, selective spot plating, etc

 

Electronic plating of precious metals: including gold plating, silver plating, palladium plating, rhodium plating, ruthenium plating, etc. - bath water treatment and metal recovery

 

Process conditions: electrolyte, acid / cyanide system, brightener and additive

PH: 4-5

Temperature: 30 - 70 ℃

Current density: 250 - 30000 a / M

Anode type: Platinum titanium mesh anode and iridium metal oxide coating can be used;

Electronic plating