Application | Product Center | About us | News | Contact |
Chlor alkali chemical industry Electrolytic copper foil Electronic plating Hydrometallurgy Steel plate electroplating Metal plating more + |
Ruthenium Series MMO Anode Iridium Series MMO Anode Platinum Plated Titanium Anode Lead Dioxide Coated Titanium Anode Platinum Plated Niobium Anode BDD Anode Electrolyzer design and production Organic synthesis cell |
Profile Factory |
Company News Industry information |
Sales:(+86)527-8768 6007 (+86)138 1570 1819 Fax:(+86)527-8768 6000 E-mail:szphm@vip.126.com Mr Pan:(+86)136 0621 8252 Mr Chen: (+86)13815701819 Add:No.1, Zhangqi Road, National Economic Development Zone, Shuyang County, Jiangsu Province |
Electronic plating refers to the plating of a thin layer of metal, such as copper, nickel, tin, gold, silver, platinum, rhodium, palladium, or its alloy metal on the surface of electronic components. Electronic plating process can be widely used in many application fields, including circuit board plating and connector plating in batch plating process, as well as diversified continuous plating process used in the production of semiconductors, connectors and other components for electronic industry In these processes, both soluble and inert titanium anodes are used.
Circuit board reverse pulse copper plating
Due to the design requirements of circuit board tend to fine wire diameter, high density, fine hole diameter (high depth diameter ratio, even micro through hole), filling blind hole, the traditional DC plating becomes more and more unable to meet the requirements, especially in the coating of hole center of through-hole plating, usually the copper layer at both ends of the hole diameter is too thick but the central copper layer is insufficient. The unevenness of the coating will affect the effect of current transmission and directly lead to poor product quality. In order to balance the thickness of copper on the surface, especially in the pores and micropores, it is necessary to reduce the current density, but this will prolong the plating time to an unacceptable extent. With the development of reverse pulse electroplating process and chemical additives suitable for electroplating process, shortening the electroplating time has become a reality. These problems can be overcome by reverse pulse electroplating process.
Typical process conditions
Electrolyte: CuSO4 · 5H2O, 100-300 g / L H2SO4, 50-150 g / L additive temperature: 20 - 70 ° C
Current density: usually 500-1000a / m2 forward pulse current and three times reverse pulse current; general forward pulse 19ms, reverse 1ms;
Or adjust the current density and pulse time anode type according to the process: special iridium metal oxide mixture coating
Vertical continuous DC copper plating of circuit board
Typical process conditions
Electrolyte: CuSO4 · 5H2O, 200-240 g / L H2SO4, 80-100 g / L Cl -, 40-55 ppm additives temperature: 20-70 ° c current density: 100-500 A / m ² DC
Anode type: special iridium metal oxide mixture coated titanium anode; special requirements for additive consumption
Circuit board gold plating
Electroplating a layer of nickel, tin or gold on the end contact part of electronic components can improve its conductivity. In circuit board manufacturing, usually a layer of nickel / gold is electrodeposited, which can make the contact point have low contact resistance, good wear resistance and oxidation resistance, as well as corrosion protection.
Typical process conditions
Electrolyte acid / cyanide systems, brighteners and additives
Au : 4-10 g/l
CN -: low concentration pH: 4-5
Temperature: 50-60 ° C
Current density: 0.1 – 1.0 ASD; average 0.2 ASD
Anode type: platinum and IR MMO coating can be used;
The thickness of platinum on electroplated platinum anode can be selected from 1um to 10um, or even thicker
Other fields
Semiconductor components electroplating: roll to roll plating, contactor parts plating, lead frame plating, electropolishing, selective spot plating, etc
Electronic plating of precious metals: including gold plating, silver plating, palladium plating, rhodium plating, ruthenium plating, etc. - bath water treatment and metal recovery
Process conditions: electrolyte, acid / cyanide system, brightener and additive
PH: 4-5
Temperature: 30 - 70 ℃
Current density: 250 - 30000 a / M
Anode type: Platinum titanium mesh anode and iridium metal oxide coating can be used;
Electronic plating